Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

Acrosser Technology Co. Ltd, a world-leading industrial and embedded computer designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-HM76Z1FL, Acrosser’s latest industrial endeavor, is surely a FIT under multiple circumstances. Innovation can be seen in the new ultra slim fanless design, and its Intel core i CPU can surely cater for those seeking for high performance. Therefore, these 3 stunning elements can be condensed as "F.I.T. Technology." (Fanless, Intel core i, ultra Thin)

The heat sink from the fanless design provides AES-HM76Z1FL with great thermal performance, as well as increases the efficiency of usable space. The fanless design provides dustproof protection, and saving the product itself from fan malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20 millimeters (272 mm x183 mm x 20 mm). This differs from most embedded appliances, which have a height of more than 50 millimeters.

The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4 x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or WiFi module.

Different from most industrial products that focus on application in one specific industry, the AES-HM76Z1FL provides solutions for various applications through the complete I/O interfaces. Applications of the AES-HM76Z1FL include: embedded system solutions, control systems, digital signage, POS, Kiosk, ATM, banking, home automation, and so on. It can support industrial automation and commercial bases under multiple circumstances.

Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)

Product Information:

http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3／i7-AES-HM76Z1FL.html

Contact us：

http://www.acrosser.com/inquiry.html

Introduction to model-based design

With model-based design, UAV engineers develop and simulate system models comprised of hardware and software using block diagrams and state charts, as shown in Figures 1 and 2. They then automatically generate, deploy, and verify code on their embedded systems. With textual computation languages and block diagram model tools, one can generate code in C, C++, Verilog, and VHDL languages, enabling implementation on MCU, DSP[], FPGA[], and ASIC hardware. This lets system, software, and hardware engineers collaborate using the same tools and environment to develop, implement, and verify systems. Given their auto-nomous nature, UAV systems heavily employ closed-loop controls, making system modeling and closed-loop simulation, as shown in Figures 1 and 2, a natural fit.
Testing actual UAV systems via ground-controlled flight tests is expensive. A better way is to test early in the design process using desktop simulation and lab test benches. With model-based design, verification starts as soon as models are created and simulated for the first time. Tests cases based on high-level requirements formalize simulation testing. A common verification workflow is to reuse the simulation tests throughout model-based design as the model transitions from system model to software model to source code to executable object code using code generators and cross-compilers.
An in-the-loop testing strategy is often used as itemized below and summarized in Table 2:
1. Simulation test cases are derived and run on the model using Model-In-the-Loop (MIL) testing.
2. Source code is verified by compiling and executing it on a host computer using Software-In-the-Loop (SIL) testing.
3. Executable object code is verified by cross-compiling and executing it on the embedded processor or an instruction set simulator using Processor-In-the-Loop (PIL) testing.
4. Hardware implementation is verified by synthesizing HDL and executing it on an FPGA using FPGA-In-the-Loop (FIL) testing.

5. The embedded system is verified and validated using the original plant model using Hardware-In-the-Loop (HIL) testing.
A requirements-based test approach with test reuse for models and code is explicitly described in ARP4754A, DO-178C, and DO-331, the model-based design supplement to DO-178C.

refer to:
http://mil-embedded.com/articles/transitioning-do-178c-arp4754a-uav-using-model-based-design/

The networking influence of traffic 4.0

To find an example of how data intensive these solutions can be one only has to look at the needs of the leading Korean flat panel display manufacturers. Their tolerance for so-called ‘dead pixels’ is almost zero. To put this into perspective, a modern HD screen has 1080 vertical pixels horizontally and 1920 vertically. That’s 2,073,600 pixels on each unit. The manufacturing processes have to check each of these pixels, hundreds of times a day to ensure quality and control yield. It’s easy to see how quickly applications like this will generate vast volumes of data.

As another example, the global automotive industry produces countless different combinations of each vehicle model at an incredible rate. It’s typical for an assembly plant to produce a complete vehicle at a rate of more than one per minute.

Producing these countless different versions at such a pace demands a huge amount of flexibility and a great deal of bandwidth to cope with both the production instructions and the quality control. Most models today have literally thousands of different model configurations depending on customer option choice. To complicate things further, it’s not uncommon for one assembly plant to produce a variety of models. Again, it’s easy to see how this puts huge demands on the networking that deliver this information to the assembly line systems that ensure the correct parts are fitted on the correct vehicle.

As well as the sheer quantity of data that the Internet of Things (IoT) element of Industry 4.0 demands, there is also an interoperability question raised by the M2M (Machine to Machine) issue.

If our factories are full of machines prompting other machines to take action, we had better hope that those machines can talk to each other effectively without any compatibility problems.

In order to make sure that machine X can talk to machine Y we need to ensure that a rigorous conformance testing process is in place. You have to be confident that anything designed for the network, works with the network.

It’s for this reason that the CLPA devotes a great deal of effort to ensuring that our partners’ products have been tested to the necessary standards. We have created a global network of conformance testing centres that ensure no matter where a partner is located, they have access to convenient local conformance test labs that help speed their time to market.

The evidence is compelling - there is an installed base of over nine million CC-Link devices, but every year the CLPA only discovers a handful of instances of incompatibility.

refer to:http://www.connectingindustry.com/automation/the-networking-implications-of-industry-40.aspx

JR and AWL team up for greater sucess

Among the current automation market war, AWL is a leader in production industrial computer and experienced in the automotive and general industries with proficiency in laser welding.  With JR and AWL’s standing as leading global system integrators, this strategic embedded system partnership will facilitate an environment rich with knowledge, ability, and possibility for our customers. In addition to increasing available resources, JR and AWL will share knowledge and expertise on the latest technologies, keeping both companies on the cutting edge.

refer to: http://www.automation.com/jr-automation-and-awl-techniek-join-forces

Benefits for embedded webinar forum

Much of the content will be based around the embedded computers development and validation of Autosar compliant code and the development of code for specific devices such as the BOSCH GTM, the AURIX and Freescale's Nexus based Qorivva solutions. Some of the presentations will also touch on the debugging of code on multicore systems. Delegates will also have the opportunity to discuss their specific challenges and requirements.

“Developing reliable software for safety critical embedded computers  can be very challenging,” said Barry Lock. “We have recently developed several important new techniques, such as ‘long-term trace’. It is this kind of innovation that is enabling faster and more effective code development. I think engineers will greatly benefit from this embedded computers Forum.”

For more information and to register please visit www.lauterbach.com/1809

refer to: http://embedded-computing.com/news/lauterbach-software-debugging-workshops/

Bridge your system together with embedded computer

For systems where there is a clear single host device and other processors and accelerators operate as slave devices, embedded computer is a good choice for connectivity. However, for connecting many processors together in more complex systems, embedded computer has significant limitations in topology and support for peer-to-peer connectivity.

Many developers are looking to leverage Ethernet as a solution for connecting processors in embedded computers. Ethernet has evolved significantly in the past 35 years. Similar to the increase in computer processing speeds, its peak bandwidth has grown steadily. Currently available Ethernet Network Interface Controller (NIC) cards can support 40 Gbps operating over four pairs of SERDES with 10 Gbps signaling. Such NIC cards contain significant processing on their own to be able to transmit and receive packets at these speeds.

refer to: http://embedded-computing.com/articles/rapidio-optimized-low-latency-processor-connectivity/#at_pco=cfd-1.0

What about the gaming society?

There is a lot of lip service paid to BOM Control, since it is a lot easier to claim than to execute. With regularly shrinking NAND trace widths and revisions to the controller silicon/firmware it takes real commitment to maintain True BOM Control. This commitment comes with the cost of proper material planning, purchasing and stocking months to years' worth of end-of-life components as well as having production processes which guarantee gaming a stable BOM.

BOM (Bill-Of-Material) Control is one of the largest differentiators for Industrial offerings. True BOM Control locks down the controller and NAND silicon revisions as well as the firmware internal to the flash storage devices. It is very important to companies who have long gaming  qualification cycles to make sure their qualification efforts are meaningful by receiving the same BOM on production parts as was originally tested.

refer to: http://embedded-computing.com/news/benefits-industrial-flash-storage-devices/